Fused Silica MicropeL (Fused Silica Micropefer) yog ib qho amorphodder khoom tsim los ntawm high {}} qhov kub thiab txias. Nws cov txheej txheem ntau lawm cuam tshuam thiab tshuaj lom neeg, ua rau nws cov ntaub ntawv ntim hluav taws xob zoo xws li cov ntaub ntawv ntim hluav taws xob xws li cov ntaub ntawv hluav taws xob, cov khoom siv tsis meej pem, thiab pleev xim kho qhov muag.
Cov txheej txheem ntau lawm thiab cov yam ntxwv
Kev tsim cov fused silica micropower involves ua kom tag nrho cov xuab zeb quartz hauv lub tshuab hluav taws xob hauv nruab nrab ntawm 1700 {}} 2100} 2100} 2100} 2100 degree. Nws yog lintpholdized los ntawm kev txhaj tshuaj roj siab lossis dej quenching. Cov txheej txheem no tshem tawm cov qauv txheej txheem ntawm crystalline silicon, sib sau cov tshuaj pleev xim tuab. Qhov no ua rau muaj qhov qis heev coefficient ntawm nthuav (0.5 × 10⁻⁶ / degree) thiab degree) thiab cov degree) thiab cov degree) thiab cov degree) thiab cov degree) thiab kev ruaj khov zoo heev. Cov khoom loj me me yog 0.1μ m. Particle loj xa tuaj yeem yog tswj ntxiv los ntawm airflow milling lossis pob milling. Tus nruab nrab ntawm lub Inch (D50) yog feem ntau tswj tsis pub dhau lub 1-10μm khwv kom tau raws li cov kev thov sib txawv.
Tseem Ceeb Zoo
1.Qhov Purity: Cov qib ifile txawv teb chaws feem ntau tsawg dua 30ppm, thiab silica purity yog ntau dua los yog sib npaug rau 99.9%. Qee qhov siab -}}} Cov khoom lag luam tuaj yeem ncav cuag ntau dua 99.99%, tiv thaiv ion migration tsis huv.
2.Excellent Dielectric Properties: Volume resistivity >10 ·¹⁸ω · cm, thiab ib dielectric tas li (2.2 {}} 2.4 @1MHz) nce lub tshuab nqus tsev, ua rau nws lub zog loj hauv qab.
3. Tswvyim ruaj ntseg ruaj khov: tswj cov qauv txheej txheem kev ntseeg siab ntawm 1000 degree, nrog lub thermal conductivity ntawm tsuas yog 1.3-1.5.5, (mindy rwb thaiv tsev thiab kub dissipation profile.
4.Surface tshuaj muaj zog: Cov ntsiab lus hydroxyl yog tswj (0.1-1.0%), thiab sib xyaw nrog cov khoom siv organic (xws li cov neeg ua si sib txuas lus).
Cov Kev Siv Raug Raug
Hauv lub tooj liab - clad laminate kev lag luam) ntawm lub ctican hmoov ua kom muaj kev sib tw ntawm kev nthuav dav ntawm thermal kom phim nti ntim khoom. Hauv daim rhoteoltaic, nws yog siv los ua cov khoom siv txheej rau quartz crucibles, ua rau muaj kev xeb ua rau ntawm Molten Silicon. Hauv cov tshwj xeeb ceramics teb, ib tug 60% ntxiv tuaj yeem nce lub peev xwm ntawm al₂o₃ - based ceramics mus rau ntau dua 450 mpa. Tsis tas li ntawd, nws nano -}}}}}}}}}}}}}}}} Cov khoom pov thawj kho qhov muag ntawm cov photoresist cov yeeb yaj kiab thiab cov yeeb yaj kiab laser tiv thaiv.
Tswj qauv zoo
Cov Qauv Txheej Txheem Thoob Ntiaj Teb ISO 9286 thiab GB / T 12444 Qhia cov txheej txheem txheeb xyuas me me thiab tshuaj lom neeg rau cov hmoov silica, feem. High - Cov khoom lag luam zoo yuav tsum ua kom tau raws li cov hauv qab no: Fe₂o₃<10ppm, Al₂O₃ <50ppm, Cl⁻ ≤5ppm, and must pass a 28-day high-temperature storage test to verify moisture absorption (should be <0.3%).
With the development of 5G communications and third-generation semiconductor technologies, higher requirements are being placed on the sphericity (true sphericity >0.9), ultrafine particle loj (D50<1μm), and functional modification of fused silica micropowder. In the future, this material will continue to evolve towards low radioactivity (U/Th content <0.1ppb) and high thermal conductivity composites, continuously supporting technological upgrades in high-end manufacturing.
